The Daniel R. King Memorial Travel Scholarship will partially support the participation of an early career researcher in the Adhesion Society’s Annual Meeting. Dan loved bringing people together to share and grow science. This scholarship is a wonderful way to commemorate his life and his contributions to the entire soft materials community. The Scholarship fund and selection process will be managed by the Executive Committee.

Eligibility – Any PhD student or a postdoctoral researcher, who has not attended the Adhesion Society previously.

Selection criteria - Daniel R. King Memorial Travel Scholarship Award winners will be chosen based on the following criteria:

Impact that the travel and conference attendance will have on the applicant’s education and career development.

The connection of the applicant’s research focus to the field of adhesion science and engineering.

Application Procedure - To apply for the Daniel R. King Memorial Travel Scholarship, please prepare a single pdf document containing the following items:

An essay (1 page limit) describing how the travel experience and conference attendance facilitated by this scholarship will contribute to your education and career development.

A copy of the title abstract for the oral or poster presentation that was submitted for the annual meeting.

A copy of your CV or resume.

The above items should be submitted as a single pdf document to adhesionsociety@ascouncil.org

In addition to the above documents, please arrange for a letter of recommendation from a research advisor or mentor to be submitted to adhesionsociety@ascouncil.org. This letter should describe the reasons why the applicant should be considered for the scholarship award. The subject line of the email should be: “Dan King Scholarship Letter for [applicant’s name]”.

Deadline – All materials must be received by October 30th.

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